SI-forum V25

This presentation focuses on key Design for Manufacturing (DFM) aspects for PCBs, with a strong emphasis on “Via Planning.” It will cover essential via types, terminology and the impact of sequential lamination and plating on fabrication. Crucial Via DFM checks to prevent manufacturing issues will be discussed, along with a comparison of back drilling and sequential lamination.

This presentation offers crucial updates and practical recommendations for the testing of devices incorporating radio communication capabilities. We will delve into strategies for the effective utilization of radio modules to minimize testing burdens and optimize compliance efforts for both European Union and North American markets. A key segment will address the recently introduced EU Cybersecurity requirements for radio devices, providing essential insights on how to prepare. Attendees will gain valuable knowledge on anticipating and streamlining EMC and radio testing processes, empowering them to save significant time and financial resources in their product development and certification journeys.

Sikker drift av moderne elektroniske systemer krever grundig analyse av strømforsyningens integritet. Denne presentasjonen tar for seg tre kritiske aspekter: Den økende viktigheten av testing på grunn av krympende marginer og høyere strømmer, hvordan strømforsyningens integritet kan påvirke klokkejitter og praktiske hensyn ved testing av impedansen i strømfordelingsnettverket (PDN), inkludert effektive probe- og tilkoblingsmetoder.

This presentation will show the effect of stitching vias together with signal vias. Via impedance and signal eye opening from a HyperLynx simulation with one and four stitching vias will be shown.